Welcome to the official website of 2023 8th International Conference on Communication, Image and Signal Processing (CCISP 2023), which is organized by
Sichuan University, technically sponsored by IEEE Chengdu Section, supported by Asia Pacific Institute of Science and Engineering (APISE) and IEEE Chengdu
Section COM Chapter, and media supported by Journal of Electronics and Information Technology. CCISP 2023 will be held in Chengdu, China from Nov.17 to 19, 2023.

This conference is aimed at providing a platform for all researchers and engineers to share ideas, highly developed skills and successful practices to others. The
conference will last for 3 days with the reception to be held on the first day to meet and mingle with conference chairs, session chairs and other participants.

We would like to invite you to join us in this important event and share your recent advance development and research finding in Communication, Image and
Signal Processing to all attendees. Besides, it is also a good opportunity for you and your family to enjoy the culture and view in Chengdu. We are looking forward to seeing you in CCISP 2023. (CFP Flyer Downloading)

欢迎访问CCISP 2023官方网站。由四川大学主办，IEEE Chengdu Section提供技术协办，亚太科学与工程研究所(APISE)以及IEEE Chengdu Section COM
Chapter提供支持，《电子与信息学报》提供媒体支持的2023年第八届通信、图像和信号处理国际会议（简称CCISP 2023）将于2023年11月17至19日在中国成都举行。

这次会议的目的是为所有研究人员和工程师提供一个平台，让他们分享想法、高度发展的技能和成功的实践。我们诚邀您加入我们， 与大家分享您在通信、图像和信号处理的最近研究成果。此外，这也是一个很好的机会，让您和您的家人享受成都的文化和景观。

期待着在CCISP 2023见到您！

Organizer | 主办单位                       Technical Sponsor | 技术协办单位

       

Supporter | 支持单位

       

Media Partner | 媒体支持单位

 

Publication & Indexing Information 出版及检索信息     

CCISP 2023 conference is listed in IEEE conference lists！(Link)

 *All accepted and presented papers will be included into Conference Proceedings of CCISP 2023 (ISBN: 979-8-3503-0583-8) (online publishing), The
Conference Proceedings will be submitted to IEEE Xplore and submitted to EI Compendex, Scopus, Web of Science and other databases for review and
indexing. *IEEE is the copyright holder of the proceedings. The copyright of each paper should be transferred to IEEE.

*Selected papers with great extension will be recommended to publish in Selected papers with extension can be recommended for publication in international
Journal.

所有文章将进行同行评审，每篇文章将由2-3个专家进行同行评审。审稿周期为20-30天。会议收录的文章将出版在CCISP 2023会议论文集 (ISBN: 979-8-3503-0583-8) (在线出版），并提交IEEE Xplore收录，以及出版后由出版社提交至EI Compendex, Scopus, Web of Science等其他检索机构审核和检索。*IEEE是论文集版权所有者。每一篇论文的版权都应转让给IEEE。

*优秀且经拓展后的文章可推荐出版到国际期刊。

CCISP 2022 - (ISBN: 978-1-6654-5959-4) |  IEEE Xplore | Ei Compendex and Scopus CCISP 2021 - (ISBN: 978-1-6654-3279-5) |  IEEE Xplore | Ei Compendex and Scopus CCISP 2020 - (ISBN: 978-1-7281-8589-7) | IEEE Xplore | Ei Compendex and Scopus CCISP 2019 - (ISSN: 1742-6588) | IOP: JPCS | Ei Compendex and Scopus CCISP 2018 - (ISSN: 1742-6588) | IOP: JPCS | Ei Compendex and Scopus ……………… More info. could found on "Publication" pages.

CCISP 2022 index record (click to enlarge pics) CCISP 2021 index record (click to enlarge pics)

 

Peer Review Instructions & Submission/同行评审及投稿方式 

All the papers will be peer reviewed, and each paper will be peer reviewed by 2-3 experts. It takes 20-30 days for the result coming out. If the paper needs revising, it should be resubmited for peer review again. Submitted papers are evaluated using a double-blind review process for originality, relevance, and presentation. Reviewers for a paper will be kept anonymous.

1) Manuscripts must be written in English;
2) The manuscript should be written in accordance with the standard
of template;
3) The topics of paper should be relevant to conference topics;
4) Plagiarism and Duplicate submission are prohibited;
5) Innovation and scientific value is a must.

Authors can submit their manuscripts in PDF only through
electronic submission system or email.Please click following link:
Electronic Submission System: Electronic Submission System

For any inquiry about the conference, please feel free to contact us at: ccisp@apise.org.

作者仅可通过在线投稿系统提交文章（docx/pdf格式）。注：仅全文投稿可出版，全文基础页数为5页。

Past Keynote Speaker/往届主旨报告专家

Prof. Geoffrey Ye Li Imperial College London, UK	Prof. Shahram Latifi University of Nevada, Las Vegas, USA	Prof. Xinguo Yu Central China Normal University, China
Prof. Peter Han Joo Chong Auckland University of Technology, New Zealand	Prof. Songtao Guo Chongqing Univerity, China	Prof. Jimmy Liu Southern University of Science and Technology, China
Dr. Zhao Yue Southwest Communication Research Institute, China

Prof. Geoffrey Ye Li Imperial College London, UK	Prof. Shahram Latifi University of Nevada, Las Vegas, USA
Prof. Xinguo Yu Central China Normal University, China	Prof. Peter Han Joo Chong Auckland University of Technology, New Zealand
Prof. Songtao Guo Chongqing Univerity, China	Prof. Jimmy Liu Southern University of Science and Technology, China
Dr. Zhao Yue Southwest Communication Research Institute, China

 

Important Dates/重要日期 

There are two rounds important dates. 共两轮投稿。

Submission Site Open Date:
Mar. 20, 2023
First Round (第一轮）	Second Round (第二轮）
Abstract Submission Deadline：	Abstract Submission Deadline：
May 10, 2023	July 10, 2023
Full Paper Submission Deadline：	Full Paper Submission Deadline：
May 20, 2023	July 20, 2023
Notification of Acceptance:	Notification of Acceptance:
June 20, 2023	Aug. 20, 2023
Registration Deadline:	Registration Deadline:
July 20, 2023	Sept 20, 2023
Conference Dates:	Final paper Submission Deadline:
Nov.17-19, 2023	Sept. 20, 2023

Program Preview/日程预览 

Program is subject to final confirmation.The program below is only for
reference. 此日程仅供参考。

Nov.17, 2023 (Friday)
9:00-21:00	Registration and Conference Kits Collection
15:00-17:00	Technical Tour(Pending)
18:00-20:00	Welcome Dinner
Nov.18, 2023 (Saturday)
8:20am-8:40am	Opening Remark+Group Photo
8:40am-10:00am	Plenary Speech Session
10:00am-10:20am	Coffee Break
10:20am-11:00pm	Plenary Speech Session
11:00pm-12:00pm	Panel Discussion
12:00pm-13:30pm	Lunch Buffet
13:30pm-16:00pm	Special Session + Technical Session
16:00pm-16:20pm	Coffee Break
16:00pm-18:20pm	Technical Sessions
19:00pm-20:30pm	Dinner Banquet
Nov.19, 2023 (Sunday)
8:20am-9:20am	Keynote Speech Session
9:20am-10:50am	Technical Session
10:50am-11:00pm	Coffee Break
11:00am-12:00pm	Industrial Forum
12:00pm-14:00pm	Lunch Buffet
14:00pm-17:00pm	Industrial Visit